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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 5393706 B1

PDFFull Text
Date of Patent:
Feb. 28, 1995

Filed:

Jan. 07, 1993

Integrated partial sawing process

Applicant:
Inventors:

Michael A Mignardi, Dallas, TX (US);

Rafael C Alfaro, Carrollton, TX (US);

Assignee:

Texas Instruments Incorporated, Dallas, TX (US);

Attorneys:

Reed; Julie L.

Kesterson; James C.

Donaldson; Richard L.

Primary Examiner:

Brian E Hearn

Assistant Examiner:

Michael Trinh

Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437226 ; 437227 ; 148D / ;
Abstract

A process for partially sawing the streets on semiconductor wafers. After sawing the streets can be covered by a protective material, and then the wafer continues its processing as before. After the wafer is broken, the protective material may or may not be removed. Additionally, the wafer may be broken into individual chips using a wedge piece that has a number of individual wedges on it, where the individual wedges press against the partially sawn streets, causing the wafer to break.

Find Patent Forward Citations

Mignardi, Michael. (1995). Integrated partial sawing process (U.S. Patent No. 5393706). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5393706

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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