Multiprocessor module packaging

Abstract

A function module using technology which allows conductive vias to be formed in a silicon substrate in order to fabricate three dimensional multifunctional processor system is described. A silicon or other semiconductor carrier having embedded active devices therein is used as a substrate for complex functional elements disposed on both sides thereof. The semiconductor substrate includes conductive vias formed therein which interconnect single chips or multichip modules disposed on either side thereof. Using drilling/plating techniques for wafer substrates electrically interconnected devices are placed on opposite sides of the substrate. Multichip modules (MCM) including the desired functions are then fabricated having input/output (I/Os) connection points which correspond to the vias formed in the substrate. This interconnection between the MCMs and the substrate may be accomplished by providing circuitized lines and connection pads on a dielectric layer, with conductive vias therein, which is subsequently placed on the active substrate. A dielectric layer having circuitized lines therein can then be extended outwardly from the module in order to provide electrical connection to input output devices, e.g. keyboard, display, or the like, as well as other system components, such as like multifunctional elements.