The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 1995

Filed:

Nov. 05, 1993
Applicant:
Inventors:

Mitsuo Usami, Akishima, JP;

Keijiro Uehara, Sagamihara, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437-7 ; 437923 ; 437 54 ; 437205 ;
Abstract

A method for manufacturing a semiconductor integrated circuit device is described. The method comprises forming a plurality of macrocells each comprising a semiconductor integrated circuit on a semiconductor layer of an SOI (silicon on insulator) substrate, subjecting an insulating film for element separation and an insulating film in the substrate to wet etching thereby removing an unnecessary macrocell, and attaching a desired macrocell separated fabricated to the removed macrocell region. The semiconductor integrated circuit device is also described, which is free of defects and has multifunction and high reliability.


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