The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 1995
Filed:
Aug. 25, 1993
Sanae Kato, Shizuoka, JP;
Akira Sugiyama, Shizuoka, JP;
Yazaki Corporation, Tokyo, JP;
Abstract
An apparatus for manufacturing electrical interconnection assembly in which a wire is laid on wire laying pins on a pin board or an insulating support body at high velocity and with high density. The electrical interconnection assembly manufacturing apparatus according to the present invention comprises: a pinboard; a plurality of wire laying pins standing on the pinboard; a slide plate opposing tips of the wire laying pins; and a nozzle attached to the slide plate, wherein the pinboard and the slide plate relatively move under the condition that the pinboard opposes the slide plate while a wire fed from the nozzle is laid on the plurality of wire laying pins.