The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 1995
Filed:
Apr. 05, 1993
Applicant:
Inventor:
Raymond C Wells, Scottsdale, AZ (US);
Assignee:
Motorola, Inc., Schaumburg, IL (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
437225 ; 437228 ; 437966 ; 437974 ; 156636 ;
Abstract
A method for polishing a single side of a semiconductor wafer (31) is disclosed for improving wafer flatness. A protective layer (32) is formed on one side of the semiconductor wafer (31). The semiconductor wafer (31) is polished on both sides concurrently using double sided polishing equipment (38,41). The protective layer (32) prevents a surface (37) of the semiconductor wafer (31) from being polished while the other unprotected surface (36) is polished thereby producing a single sided polished wafer.