The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 1995

Filed:

Apr. 07, 1993
Applicant:
Inventors:

Jyh-Ming Ting, Fairborn, OH (US);

Max L Lake, Yellow Springs, OH (US);

Assignee:

Applied Sciences, Inc., Cedarville, OH (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C / ; C23C / ; B05D / ;
U.S. Cl.
CPC ...
427249 ; 4272551 ; 4272557 ; 427577 ; 427113 ; 427122 ;
Abstract

A method for producing a diamond/carbon/carbon composite is provided which includes the steps of densifying a preform of interwoven vapor grown carbon fibers form a carbon/carbon composite, and then depositing a polycrystalline diamond film on the carbon/carbon composite. The preform may be densified by depositing pyrolyric carbon into the interstices of the preform, either by a chemical vapor infiltration process or by a pitch infiltration process. The polycrystalline diamond film is deposited on the carbon/carbon composite by a microwave plasma enhanced chemical vapor deposition process. The resulting diamond/carbon/carbon composite can be utilized as an integral dielectric heat sink by depositing metallic circuits on the diamond layer of the diamond/carbon/carbon composite.


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