The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 07, 1995
Filed:
Apr. 03, 1992
Applicant:
Inventors:
Tha Do-Thoi, Rothenbach/P., DE;
Peter Stingl, Lauf-Kuhnhof, DE;
Assignee:
Hoechst CeramTec Aktiengesellschaft, Selb, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05D / ; C25D / ;
U.S. Cl.
CPC ...
4274432 ; 427437 ; 4274431 ; 205182 ; 205263 ; 205271 ; 205291 ;
Abstract
A process is described for electrolessly depositing or electrodepositing a solder layer composed of copper and silver and having an overall composition of silver/copper of from 75:25 to 70:30 and a total layer thickness of 15 to 100 .mu.m on a metallized ceramic. In this process, copper layers and silver layers are deposited alternately on the metallized ceramic. The number of layers is at least 3 and the individual layer thickness is 5 to 10 .mu.m.