The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 1995

Filed:

Jun. 23, 1993
Applicant:
Inventors:

Kazuhisa Ikeda, Chiryu, JP;

Minoru Tokuhara, Okazaki, JP;

Hironobu Baba, Anjo, JP;

Assignee:

Nippondenso Co., Ltd., Kariya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01L / ;
U.S. Cl.
CPC ...
73706 ; 73756 ;
Abstract

A pressure sensor has a housing (1). The housing accommodates a pressure sensing element (2) and a wiring board (3). The wiring board incorporates a lead irame (14). The lead frame connects output terminals (21) of the sensing element with ends of connector pins (12). A pressure guide (4) has a pressure path (41) and a flange (44). The flange is inserted in an opening of the housing with the pressure path being airtightly connected to a pressure intake (22) extending from the sensing element and with an end face (4a) of the flange being spaced apart from the wiring board. Potting material (5) coats the sensing element, the wiring board, and the flange of the pressure guide in the housing. If the potting material peels off the flange, water may penetrate the peeled part and reach the end face of the flange. The water, however, never reaches the wiring board because the end face of the flange is spaced apart from the wiring board. Accordingly, the lead frame in the wiring board is free from water and no migration is caused.


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