The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 1995

Filed:

Jan. 05, 1994
Applicant:
Inventors:

Richard B Booth, Wappingers Falls, NY (US);

Robert H Gephard, Poughkeepsie, NY (US);

Bradley S Gremban, Lake Katrine, NY (US);

Janet E Poetzinger, Rochester, MN (US);

David T Shen, Poughkeepsie, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ; B23P / ;
U.S. Cl.
CPC ...
29830 ; 2940206 ; 2940208 ; 29831 ;
Abstract

A method of replacing IC chip package wiring having an interposer comprising removing an interposer having a plurality of adhesively laminated interposer layers from the package, delaminating and replacing at least one interposer layer with a corrected interposer layer, relaminating the interposer layers with adhesive thus producing a replacement interposer and remounting the replacement interposer to the IC chip package.


Find Patent Forward Citations

Booth, Richard. (1995). Method for replacing ic chip package interposer (U.S. Patent No. 5384955). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5384955

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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