The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 24, 1995

Filed:

Sep. 29, 1993
Applicant:
Inventor:

Toshifumi Sano, Tokyo, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361689 ; 165 804 ; 165185 ; 165908 ; 174 163 ; 174 151 ; 257714 ; 361698 ; 361705 ;
Abstract

A cooling structure is used for forced cooling of an electronic circuit package. The cooling structure has a bottom heat radiation plate on which the electronic circuit package is mounted, a nozzle for jetting coolant toward the bottom heat radiation plate, a first vertical heat radiation plate mounted on the bottom heat radiation plate and disposed so as to surround the nozzle openings are formed in the first vertical heat radiation plate for again jetting coolant jetted from the nozzle. A second vertical heat radiation plate is mounted on the bottom heat radiation plate and is disposed so as to surround the first vertical heat radiation plate at least in an opposing relationship to the openings. The coolant jetted from the openings collides with and removes heat from the second vertical heat radiation plate.


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