The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 1995
Filed:
Aug. 12, 1992
Applicant:
Inventor:
Tatsuya Hirai, Itami, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
437207 ; 437214 ; 437217 ; 26427217 ; 257675 ; 257717 ; 257796 ;
Abstract
A method mold for producing a semiconductor device having a heat-sinking plate and a leadframe. The heat-sinking frame and leadframe are precisely positioned on a lower mold with cooperating positioning holes and pins with a space between the heat-sinking frame and the leadframe. After an upper mold is clamped to the lower mold, resin is injected into a cavity in the mold to encapsulate the leadframe to which a semiconductor chip is attached and the heat-sinking plate into one body.