The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 1995
Filed:
Nov. 10, 1993
Tomio Yamada, Gunma, JP;
Akio Hoshi, Isesaki, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
In a semiconductor device having a number of pins, there is used an inner lead group comprising a group of upper inner leads 7A present in an upper plane and a group of lower inner leads 7B in a lower plane, the upper inner lead group and the lower inner lead group being laminated together in an insulated from each other through an insulating layer 2C, both end portions in the circumferential direction of each upper inner lead 7A being overlapped with circumferential ends of adjacent lower inner leads 7B, 7B located on both sides of the upper inner lead, and bonding areas 8A of the upper inner leads 7A being positioned radially outwards with respect to bonding areas 8B of the lower inner leads 7B, whereby the pitch between inner leads can be reduced to half, and the number of pins can be increased under the condition that the size of a resin sealing body 24 is fixed. Further, wire bonding can be done properly because a reaction force induced at the time of wire bonding for the upper inner leads 7A is borne at the overlapped portions of the lower inner leads 7B, 7B.