The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 1995
Filed:
Jul. 06, 1993
Mike C Loo, San Jose, CA (US);
Marlin R Vogel, Fremont, CA (US);
Sun Microsystems, Inc., Mountain View, CA (US);
Abstract
A liquid cooling module for semiconductor chips is disclosed. The module includes a plurality of substrates, each containing at least one chip. The substrates are arranged in the module so that when coolant flows through the module, the coolant is exposed to the top and bottom surfaces of the chips. A gasket is used between each substrate. The gasket is made if a Z-axis elastromeric material that is impervious to liquid and therefore directs the flow of the coolant in the module and makes the module liquid tight. The material also is conductive in the Z direction, but not the X or Y direction, thereby making electrical communication between the chips on different substrate levels possible. The module is intended to be attached to a circuit board, thus simplifying the layout of liquid cooled chips on the board.