The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 10, 1995

Filed:

Mar. 21, 1994
Applicant:
Inventor:

Francois C D'Haese, Gent, BE;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08L / ; C08F / ; C08F / ;
U.S. Cl.
CPC ...
524272 ; 524141 ; 524377 ; 524516 ; 524547 ; 524548 ; 525186 ; 526287 ; 526320 ; 52631841 ; 428355 ;
Abstract

A pressure sensitive adhesive composition is described which is water-dispersible under acidic conditions. The composition comprises a terpolymer of a hydrophobic monomeric acrylic or methacrylic ester of a non-tertiary alcohol (monomer A); a polar monomer copolymerizable with said A monomer and having carboxylic, sulfonic acid or hydroxyl functionality or combinations thereof (monomer B); and a water soluble or water-dispersible macromolecular monomer of the formula X--Y--Z which is copolymerizable with A and B wherein X is a copolymerizable moiety containing a double bond, Y is a divalent linking group and Z is a water-dispersible polymeric moiety (monomer C). The combined acid groups employed in the B monomer are neutralized from 5 to 100% based on the total amount of acid groups in B. The composition further comprises tackifier and/or plasticizers at a level such that the ratio of terpolymer to additives falls within a range of from 0.2:1 to 5:1. The pressure sensitive adhesive composition is dispersible under a variety of pH conditions. Also described are tapes comprising the repulpable composition of the invention and their use in papermaking industry.


Find Patent Forward Citations

Loading…