The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 1995
Filed:
Oct. 04, 1993
Isao Kano, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
In a process for forming a multilayer wiring conductor structure, an interlayer insulator film is deposited on a surface including an upper surface of a lower layer wiring conductor, and the deposited interlayer insulator film is planarized so as to expose the upper surface of the lower layer wiring conductor. Then, a bonding metal film is deposited on a surface of the interlayer insulator film exposing the upper surface of the lower layer wiring conductor, and a photoresist film is coated on the bonding metal film and patterned. By using the patterned photoresist, a hole for formation of a connection pillar between the lower layer wiring conductor and a possible upper layer wiring conductor and a patterning of the bonding metal film are simultaneously formed. Accordingly, the bonding metal film can be formed and patterned on the upper surface of the lower layer wiring conductor without increasing the photolithography steps.