The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 1995
Filed:
Mar. 16, 1993
Kimihiro Nishimura, Chiba, JP;
Kenji Yoshino, Tokyo, JP;
Kawasaki Steel Corporation, , JP;
Abstract
The improved binder system for use in the injection molding of sinterable powders such as metal powders, ceramic powders and cermet powders comprises a (co)polymer that has a molecular weight in excess of 2000 and which contains at least one epoxy group in the molecule. Preferably, the binder system comprises said (co)polymer, a (co)polymer other than said (co)polymer, and an organic compound having a molecular weight up to 2000. Using a binder system comprising (a) 3-80 wt % of a (co)polymer that has a molecular weight in excess of 2000 and which has at least one epoxy group in the molecule, (b) up to 70 wt % of a (co)polymer other than component (a), and (c) 20-80 wt % of an organic compound having a molecular weight of not more than 2000, there is provided a composition for the injection molding of sinterable powders. The compound has excellent moldability and strength properties. The powders to be mixed with the binder system for use in injection molding have preferably average particle sizes in the range of 0.01-1000 .mu.m.