The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 03, 1995

Filed:

Apr. 25, 1994
Applicant:
Inventors:

Masatoshi Morikawa, Hachioji, JP;

Isao Yoshida, Tokyo, JP;

Terumi Sawase, Hannou, JP;

Kouzou Sakamoto, Hachioji, JP;

Takeaki Okabe, Tokyo, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01K / ; H03K / ;
U.S. Cl.
CPC ...
364483 ; 364489 ; 361106 ; 361101 ; 323314 ; 327108 ; 327538 ; 327512 ;
Abstract

A semiconductor integrated circuit has a semiconductor output device (3) , a sensor (5) generating an electric signal (7) relevant to heat generation (6) of the output device (3) and a microprocessor unit MPU 2, inside a chip (1). The MPU (2) is constructed of a memory (20) and CPU (22). The electric signal (7) generated from the sensor (5) is processed by the CPU (22) in accordance with a stored program of the memory (20). Accordingly, the drivability of the semiconductor output device (3) can be set in an optimum state corresponding to changes in chip temperature including changes that are only momentary.


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