The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 1995
Filed:
Mar. 25, 1993
Sang S Lee, Sunnyvale, CA (US);
George Fujimoto, Santa Clara, CA (US);
VLSI Technology, Inc., San Jose, CA (US);
Abstract
An improved packaging technique for packaging a thermally-enhanced, molded-plastic quad flat package (TE-QFP). An integrated-circuit die is attached to a thermally conductive, electrically-insulated substrate having a stepped area formed into the outer margins thereof. A lead frame has inwardly-extending fingers, which are attached to the stepped areas in the outer margins of the thermally conductive, electrically-insulated substrate. The stepped area centers the thermally conductive, electrically-insulated substrate and attached integrated-circuit die within the mold cavity so that the flow of plastic material is balanced over the top and bottom of the substrate to provide a molded package body substantially free of voids.