The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 1995
Filed:
Feb. 25, 1993
Tomoyuki Shirasaki, Hachioji, JP;
Osamu Kuwabara, Tokyo, JP;
Casio Computer Co., Ltd., Tokyo, JP;
Abstract
This application discloses a film wiring board for directly mounting an electronic parts such as an IC chip, on which a protective film having an opening can be formed in one step by a screen printing. This film wiring board has wiring patterns including connection pads and lead wires. Connection electrodes of the IC chip are connected to the connection pads via soldering bumps. Since the width of each of the lead wires is comparatively small at 10 .mu.m-30 .mu.m, the once molten solder when the connection is done is kept on the corresponding connection pad by the surface tension and is prevented from flowing from the connection pad to the corresponding lead wire. Therefore, since the opening of the protective film need not have a function for stopping the flow of the solder, there may be no problem if the opening is comparatively enlarged. Consequently, the protective film having the opening can be formed in one step by the screen printing, and then a productivity of the film wiring board may be increased and its production cost can be reduced.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile