The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 27, 1994

Filed:

Aug. 31, 1992
Applicant:
Inventors:

Motoshu Miyajima, Kawasaki, JP;

Yasuyuki Ichihashi, Kawasaki, JP;

Assignee:

Fujitsu Limited, Kanagawa, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
156636 ; 437228 ; 252 795 ; 106-3 ;
Abstract

This invention discloses a polishing method for flattening an inter-level insulating film or polycrystalline silicon inside a device isolation ditch in a semiconductor fabrication process. To this end, the present invention grinds and flattens an insulating film having a step on the surface thereof by using a polishing solution containing an alkali solution and a grain, wherein a cation concentration in the alkali solution is higher than an OH.sup.- ion concentration in the alkali solution.


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