The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 13, 1994

Filed:

Feb. 28, 1994
Applicant:
Inventor:

Fredrick W Barrett, Glendale, AZ (US);

Assignee:

Motorola, Inc., Schaumburg, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361699 ; 165 804 ; 257714 ;
Abstract

The heat dissipation and mechanical stability of an electronic circuit module package (10) is enhanced by filling the module cavity (20) with a perflourinated hydrocarbon cooling liquid, and by placing a micro-bellows (24, 28) within the module cavity. The temperature compression and expansion characteristics of the perflourinated hydrocarbon liquid are compensated by the action of the micro-bellows. The module package contains semiconductor die (16, 18) that require cooling during operation. The perflourinated hydrocarbon liquid provides the necessary heat transfer to the module package.


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