The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 1994
Filed:
Sep. 27, 1993
Katuaki Sugino, Nagoya, JP;
Masahito Morita, Nagoya, JP;
NGK Spark Plug Co., Ltd., Aichi, JP;
Abstract
A package body for an integrated circuit is provided with a substrate having a mounting portion for mounting the integrated circuit. A terminal member for high speed signal input-output is provided on a portion of the substrate except the mounting portion of the substrate. A high speed signal transmission line has one end portion to be connected to the integrated circuit and the other end portion connected to the terminal member and is formed at a portion of the substrate except the mounting portion of the substrate. A plating tie-bar is formed at the substrate so as to extend from an outer periphery edge of the substrate inwardly for electrolytically plating the one end portion of the high speed signal transmission line and the terminal member. A portion of the high speed signal transmission line is arranged more extendingly toward the outer periphery edge of the substrate than the one and other end portions of the high speed signal transmission line, and the inwardly extending end portion of the plating tie-bar is connected to the extending portion of the high speed signal transmission line.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile