The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 1994
Filed:
Feb. 24, 1993
Osamu Kamimura, Yokohama, JP;
Kunio Matsumoto, Yokohama, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A multilayered wiring board having a printed inductor which is formed on a grounding layer or electric power supply layer through a dielectric layer inserted between them, wherein a removed portion is formed only in the grounding layer or electric power supply layer which is positioned right under the printed inductor and in the neighboring area and no removed portion is formed in the dielectric layer. According to this structure, without increasing the manufacture cost, the distance between the printed inductor and the grounding layer or electric power supply layer opposite to it spreads to the lower electric power supply layer or grounding layer and the stray capacity existing therebetween is reduced, and a reduction of the self-resonance frequency of the printed inductor is prevented, and the frequency characteristics improve.