The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 13, 1994

Filed:

Jul. 09, 1993
Applicant:
Inventors:

Michiya Okamura, Ibaraki, JP;

Tetsuo Konno, Ibaraki, JP;

Kouichi Sagisaka, Ibaraki, JP;

Masakazu Ikeda, Mie, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K / ; C08K / ; C08K / ; C08J / ;
U.S. Cl.
CPC ...
524413 ; 524451 ; 524494 ; 524496 ;
Abstract

A process for producing a resin compound applicable to precise electronic parts, especially sliding member from thermoplastic engineering plastics is disclosed, comprising compounding (I) a carbon masterbatch comprising polyethylene having a density of not less than 0.92 g/cm.sup.3 and an MI of from 0.1 to 30 g/10 min, conductive carbon black, and talc and (II) a thermoplastic engineering plastic. The carbon black is satisfactorily dispersed to impart satisfactory heat conductivity to a molded article to thereby providing a sliding member with little wear and long durability.


Find Patent Forward Citations

Okamura, Michiya. (1994). Process for producing a resin compound (U.S. Patent No. 5373046). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5373046

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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