The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 1994
Filed:
Mar. 06, 1992
Subramanian Rangaswamy, Rochester Hills, MI (US);
Robert A Miller, Oak Park, MI (US);
Sulzer Plasma Technik, Inc., Troy, MI (US);
Abstract
A method of forming binderless clad powders using a high energy ball mill, preferably an attritor-type ball mill, is described. The binderless clad powders are formed by combining and processing a core material powder and a coating material (either a powder with significantly smaller particle size than the core material powder or a brittle material that will quickly form a powder with significantly smaller particle size than the core material powder) in a high energy ball mill for a relatively short time (generally less than one hour The processing time employed is such that the particle size of the core material powder is not significantly reduced but that the clad powders are formed. At least one of the two materials (i.e., core forming material or coating forming material) must be deformable within the high energy ball mill. Such binderless clad powders are suitable for use as thermal spray powders and which can be thermally sprayed to form coatings on a various substrates.