The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 1994

Filed:

Jul. 30, 1993
Applicant:
Inventors:

Tamaki Toba, Yokohama, JP;

Atsuko Ohkawa, Yokohama, JP;

Yasuo Hira, Yokohama, JP;

Masayasu Fujisawa, Ninomiya, JP;

Isao Hashimoto, Hitachi, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01B / ; G01B / ;
U.S. Cl.
CPC ...
356 73 ; 356378 ; 356382 ;
Abstract

A thickness/depth measuring apparatus and method for measuring the thickness of a film forming a lattice-shaped mask and the depth of a groove formed on a workpiece during processing of the workpiece. The thickness/depth measuring apparatus and method provide for irradiating the workpiece with a coherent light beam, controlling the direction for linear polarization of the coherent light beam irradiated onto the workpiece, adjusting the incident angle of the coherent light beam irradiated onto the workpiece in a predetermined angular range, receiving and detecting reflected light reflected by the workpiece at different irradiated incident angles and including higher-order diffracted light; and calculating the thickness of the film and the depth of the groove in accordance with the intensity of the diffracted light detected.


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