The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 1994
Filed:
Nov. 02, 1993
Akira Yamakawa, Hyogo, JP;
Nobuo Ogasa, Hyogo, JP;
Sumitomo Electric Industries, Ltd., Osaka, JP;
Abstract
A metallized layer is to be formed on a surface of an aluminum nitride base material, which may be a sintered body or a nonsintered compact. A mixture is prepared from an oxide component consisting of at least one of Al.sub.2 O.sub.3, SiO.sub.2, CaO, and Y.sub.2 O.sub.3, an iron family component consisting of at least one of Fe, Co and Ni and high melting temperature metal consisting of W and Mo. The content of each component is within a specified range. A paste is prepared by adding an organic binder substance to the mixture. The paste is applied to the surface of the base material and heated under specified conditions to form a metallized layer having a high adhesive peel strength on the surface of the base material.