The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 1994

Filed:

Sep. 20, 1993
Applicant:
Inventors:

Masaichi Inaba, Ushiku, JP;

Norimasa Fujita, Ushiku, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
29846 ; 156901 ; 174259 ; 2281801 ;
Abstract

This invention provides a method of forming a circuit wiring pattern which cannot be formed by a prior art method such as etching or plating. This method comprises a step of forming trenches for forming a circuit wiring pattern at predetermined positions on at least one of the surface of an insulating base material and then filling a conductive material into the trenches, a step of removing conductor layers in such a manner that the conductor layers formed by the step described above exist only in the trenches formed in the insulating base material and gap portions of the circuit wiring pattern comprising the conductor layers formed in the trenches of the insulating base material are exposed, and a step of forming an insulating surface protection layer.


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