The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 1994
Filed:
Oct. 05, 1990
Masashi Okada, Kyoto, JP;
Tetsuo Maeda, Kyoto, JP;
Kenji Nakamura, Kyoto, JP;
Kenichi Hibino, Kyoto, JP;
Sanyo Chemical Industries, Ltd., Kyoto, JP;
Abstract
A composite for moldings having the high bending elastic modulus and the high bending strength, comprising a thermoplastic resin and a polymerizable monomer which is a multifunctional polymerizable monomer having an alicyclic strucure unit or a mixture consisting of a multifunctional polymerizable monomer having an alicyclic strucure unit and a monofunctional polymerizable monomer having at least two alicyclic structure units, is prepared by compounding them. Also, a composite for moldings having the high bending elastic modulus and the high bending strength, comprising a vinyl chloride resin, a (meth)acrylate monomer which is a multifunctional (meth)acrylate or a mixture consisting of a multifunctional (meth)acrylate and a monofunctional (meth)acrylate, and a polymerization initiator. The composite has good workability. Further, an unfluid precursor for moldings is prepared by heating the composite. The obtained moldings have high bending modulus of elasticity and high bending strength, and then are suitably applied to business machines, parts of electric equipment, industrial equipment, and parts of transport equipment etc.