The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 1994
Filed:
Jul. 26, 1991
Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;
Abstract
A metal foil-clad laminate obtained by lamination molding a resin-impregnated substrate and a metal foil, wherein the resin-impregnated substrate contains from 5 to 30% by weight of at least one inorganic filler selected from the group consisting of calcined kaolin, spherical fused silica, non-swellable synthetic mica, and a glass fine powder, the filler having an average particle diameter of from 0.1 to 5 .mu.m and at least 90 wt % of the filler having a particle diameter of from 0.02 to 5 .mu.m, and the resin-impregnated substrate is used as at least a surface layer of the laminate or as a resin-impregnated substrate which adheres the metal foil, thereby providing a surface smooth metal foil-clad laminate having a diminished surface undulation attributable to the substrate.