The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 1994
Filed:
Jun. 28, 1993
Herman S Hoffman, Milton, VT (US);
Richard W Noth, Milton, VT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A compliant lead for electromechanically surface mounting an integrated circuit chip package to a substrate. The compliant lead extends from the package and includes at least two regions of different lead thickness. In a first region, a standard lead thickness is employed to ensure the applicability of existing package fabrication techniques. A second region, having a reduced thickness, then extends from the first region and is predefined to encompass an area of the lead expected to undergo greatest stress during thermal cycling. Compliancy is further guaranteed by providing a solder dam within the region of reduced thickness to limit wicking of solder when the package is solder mounted to the substrate. Lead frame fabrication is also discussed.