The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 1994
Filed:
Apr. 02, 1992
Shiuh-Hui Chen, Lake Zurich, IL (US);
Carl Ross, Mundelein, IL (US);
Roseann M Tomasello, Mundelein, IL (US);
Anita G Brandes, Arlington Heights, IL (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A device with bonded and conductive substrates is disclosed. This device includes a conductive substrate (509) having an electrically insulating layer (515) disposed on a portion thereon. An electrically conductive layer (519) is disposed on the electrically insulating layer (515). Then an insulating substrate (101) having a first surface (103) and an opposing second surface (105) with an electrically conductive coating (516) disposed on a portion thereon is provided. Finally, the insulating substrate (101) is bonded to the electrically conductive layer (519). In a more specific embodiment a capacitive pressure sensor is disclosed. This capacitive pressure sensor has a sealed chamber (125) and is further constructed with a conductive substrate (509) having an electrically insulating layer (515) disposed thereon. Further, an electrically conductive layer (519) is located on the electrically insulating layer (515) and an insulating substrate (101) having an electrically conductive coating (516) disposed thereon is bonded to the electrically conductive layer (519). Conductive feedthrough passageways (107, 109) are provided so that a measurement circuit may be electrically connected to the capacitive pressure sensor. Additionally a method for fabricating such devices is disclosed.