The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 1994

Filed:

Nov. 29, 1991
Applicant:
Inventors:

Toshio Hatada, Tsuchiura, JP;

Shigeo Ohashi, Tsuchiura, JP;

Tadakatsu Nakajima, Ibaraki, JP;

Heikichi Kuwahara, Ibaraki, JP;

Hitoshi Matsushima, Ryugasaki, JP;

Motohiro Sato, Ibaraki, JP;

Hiroshi Inouye, Ibaraki, JP;

Takao Ohba, Hadano, JP;

Akira Yamagiwa, Hadano, JP;

Kanji Otsuka, Higashiyamato, JP;

Yuuji Shirai, Kodaira, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361699 ; 361689 ; 361704 ; 361765 ; 174 163 ; 165 804 ;
Abstract

A cooling apparatus for an electronic device of high calorific density including an elastomer interposed between a semiconductor chip and a heat sink so as to connect them thermally. The elastomer may also be in close contact with a large number of semiconductor chips having various configurations which are mounted on a board, so that the elastomer is thermally connected with them, whereby the elastomer absorbs thermal deformations.


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