The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 1994
Filed:
Mar. 02, 1990
Applicant:
Inventors:
Wolfgang von Gentzkow, Kleinsendelbach, DE;
Juergen Huber, Erlangen, DE;
Wolfgang Rogler, Moehrendorf, DE;
Dieter Wilhelm, Forchheim, DE;
Assignee:
Siemens Aktiengesellschaft, Munich, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K / ; C08L / ; C08L / ;
U.S. Cl.
CPC ...
523429 ; 525486 ; 525525 ; 525526 ;
Abstract
The invention provides epoxide resin molding compositions for protectively covering semiconductor components, which are accessible in a cost-effective manner and have good processibility. The epoxide resin molding compositions provide virtually inflammable molded materials with a high glass transition temperature and a low thermal expansion coefficient without the addition of flameproofing agents, when they contain the following constituents: