The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 1994
Filed:
Apr. 06, 1994
Jay D Baker, West Bloomfield, MI (US);
Myron Lemecha, Dearborn, MI (US);
Richard K McMillan, II, Dearborn, MI (US);
Kenneth A Salisbury, Livonia, MI (US);
Paul E Stevenson, Colorado Springs, CO (US);
Thomas B Merala, Canton, MI (US);
Wells L Green, Garden City, MI (US);
Matti Mikkor, Ann Arbor, MI (US);
Bernard A Meyer, Taylor, MI (US);
Ford Motor Company, Dearborn, MI (US);
Abstract
A micro soldering apparatus and method comprising a system (10) for attaching an electronic component (12) to a substrate (14). The system (10) comprises a soldering tool (16) including a dispensing orifice assembly (18) for pulsatingly dispensing a controlled quantity of molten solder (19) to a component (12) and substrate (14) so that the component is joined to the substrate (14) mechanically and electrically upon solidification of the molten solder (19). There is no physical contact between the dispensing orifice assembly (18) and joint. The system (10) also includes a controller for the soldering tool (16). The controller functions in response to process control parameters so that the controlled quantity of molten solder (19) is dispensed through a non-oxidizing atmosphere by a pressure pulse applied to the molten solder.