The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 1994

Filed:

Apr. 12, 1993
Applicant:
Inventors:

George W Stacher, Westminister, CA (US);

Murray W Mahoney, Camarillo, CA (US);

Assignee:

Rockwell International Corporation, Seal Beach, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23K / ;
U.S. Cl.
CPC ...
228103 ; 2282351 ;
Abstract

An apparatus and a method for measuring the temperature of a reactive metallic workpiece sealed within a retort prior to and during diffusion bonding of the workpiece. The apparatus includes temperature measuring instruments disposed adjacent preselected portions of the workpiece within the retort, thermal conducting means connecting the instruments with display devices located outside the retort, conduits coupled with the interior of the retort and with the display devices, each of the conduits including a first end portion communicating the interior of the retort with vacuum generating means and a second end portion including at least one tubular region through which the thermal conducting means pass to connect with the display devices, and means for sealing the first and second end portions to maintain an evacuated state within the retort after a vacuum is applied thereto. The method contemplates measuring the temperature at the preselected portions of the workpiece within the retort while conducting the diffusion bonding process and then using the measured temperatures to control the temperatures applied to and within the retort during subsequent diffusion bonding processes.


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