The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 1994
Filed:
May. 28, 1992
Applicant:
Inventors:
Hiroshi Komorita, Kanagawa, JP;
Nobuyuki Mizunoya, Kanagawa, JP;
Assignee:
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ; H05K / ;
U.S. Cl.
CPC ...
361762 ; 174255 ; 174256 ; 156 87 ; 361748 ; 361760 ; 361807 ; 361809 ;
Abstract
A bonded ceramic-metal composite substrate comprising a ceramic substrate having opposite surfaces and a copper sheet having a face directly bonded to one of the surfaces of the ceramic substrate, characterized in that the Vickers hardness of the copper sheet lies in the range from 40 kg/mm.sup.2 to 100 kg/mm.sup.2.
Komorita, Hiroshi. (1994). Bonded ceramic-metal composite substrate, circuit board constructed (U.S. Patent No. 5363278). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5363278
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile