The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 1994
Filed:
Dec. 16, 1992
Applicant:
Inventor:
Osamu Tanaka, Kyoto, JP;
Assignee:
Rohm Co., Ltd., Kyoto, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361760 ; 361743 ; 361750 ; 361767 ; 174 521 ; 1741 / ; 257779 ; 257783 ;
Abstract
The structure and method for mounting a semiconductor device, in which a wiring pattern 2 on a circuit substrate 1 and projection electrodes 5 of an integrated circuit 4 are made to be in opposition to and connected to each other, the wiring pattern 2 is connected to the projection electrodes 5 while penetrated through an adhesive and thermosetting thin film member 3 covering the wiring pattern 2; and the integrated circuit 4 is held onto the circuit substrate 1 by a hardening force of the adhesive and thermosetting thin film member 3.