The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 1994
Filed:
May. 26, 1993
Chikafumi Oomachi, Chiba, JP;
Yasuyuki Tanaka, Ibaraki, JP;
Nippon Mektron, Ltd., Tokyo, JP;
Abstract
An IC-mounting flexible circuit board and the process of producing the same in which the process comprises the steps of forming bump protrusions passing through a flexible circuit board to be electrically conductive with a circuit wiring pattern in such a way that the bump protrusions are allowed to protrude from the back surface of the flexible circuit board, and arranging to have the surface of each bump protrusion coated with junction metal in accordance with the structure of the protrusion, so that a bare IC chip is simply bonded to the bump protrusions of the flexible circuit board by means of heat fusion or ultrasonic bonding. An excimer laser means is preferably used for boring small holes in an insulating base to form bump protrusions, i.e., IC pad junction protrusions on the flexible circuit board. Such an IC pad junction protrusion is formed by a plating means such as soldering or the filling of a conductive member. Moreover, a reflow process is employed to form the preferably semicircular protruding portion of the IC pad junction protrusion.