The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 1994
Filed:
Dec. 11, 1992
Applicant:
Inventors:
Shiro Honda, Aichi, JP;
Yasushi Sawamura, Aichi, JP;
Masayuki Tanaka, Aichi, JP;
Keiji Kayaba, Aichi, JP;
Toshihiro Teshiba, Aichi, JP;
Assignee:
Toray Industries, Inc., , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K / ;
U.S. Cl.
CPC ...
523220 ; 523223 ; 523427 ; 523434 ; 523443 ;
Abstract
Disclosed is a semiconductor device-encapsulating epoxy resin composition comprising (i) an epoxy resin (A) containing at least one of a bifunctional epoxy resin (a1) having a biphenyl skeleton and a bifunctional epoxy resin (a2) having a naphthalene skeleton, (ii) a curing agent (B), and (iii) a filler containing fused silica (C) having a specified kind and specified mean particle diameter. This composition has an excellent heat resistance of solder, and further reliability after thermal cycles and reliability after solder-bath dipping.