The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 1994
Filed:
Aug. 02, 1993
Applicant:
Inventors:
Yoshihiko Takano, Kyoto, JP;
Atsuo Senda, Kyoto, JP;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C / ; C23C / ;
U.S. Cl.
CPC ...
106-122 ; 106-125 ; 4274431 ;
Abstract
Disclosed herein is an electroless solder plating bath capable of autocatalytically depositing solder on a metal such as copper or nickel or an activated non-conductor base material in an arbitrary film thickness and an arbitrary film composition. This plating bath contains bivalent ions of tin and bivalent ions of lead as metal ions, a complexing agent, and a reductant, while the reductant contains trivalent titanium ions. The plating bath can be used at a temperature of 40.degree. to 80.degree. C., with a pH value of 5.0 to 11.0.