The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 1994
Filed:
Mar. 18, 1991
Kazutaka Sato, Kashiwa, JP;
Michihiro Watanabe, Tsuchiura, JP;
Shogo Matsumoto, Ibaraki, JP;
Hiroyuki Tobita, Katsuta, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A thick film thermal printing head having a substrate, an insulating glaze layer formed on the substrate, a heating resistor formed into a straight elongated shape, a driver IC for controlling energization of the heating resistor, a plurality of first lead wires for connection between the heating resistor and the driver IC, a common electrode serving as an intermediate power supply point through which electric power is supplied to the heating resistor, and a plurality of second lead wires for connection between the heating resistor and the common electrode, the first and second lead wires are alternately disposed parallel to each other, at least the first lead wires, the second lead wires and the common electrode being formed on the glaze layer. The heating resistor is formed in the vicinity of an end surface of the substrate, and the lead wires, the common electrode and the driver IC and other components are suitably arranged to form a thick film thermal printing head structure having no insulating interlayer and no through holes at the connection between the lead wires and the common electrode, enabling simplification of the manufacture process and a reduction in the manufacture cost. It is also possible to improve the printing performance of a thermal transfer facsimile apparatus or thermal transfer printer as well as to reduce the size thereof by using the thick film thermal printing head of the present invention.