The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 1994
Filed:
Feb. 01, 1993
James C Van Zee, Phoenix, AZ (US);
Gregory L Westbrook, Chandler, AZ (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A method of forming a contact between a semiconductor die (10) and a probe (36, 37, 38, 41, 42). The semiconductor die (10) has an integrated circuit region (11) and a bonding pad region (12). A conductive plane (31, 32) couples a bonding pad (16, 17) on one side of the semiconductor die (10) with a bonding pad (16, 17) on an opposite side of the semiconductor die (10). A first probe (41, 42) is positioned a first vertical distance above the conductive plane (31, 32) and a second probe is positioned a second vertical distance above the bonding pad (16, 17) on the semiconductor die (10). The second vertical distance is greater than the first vertical distance. Contacting a portion of the conductive plane (31, 32) with the first probe (41, 42) followed by contacting the bonding pad (16, 17) on the semiconductor die (10)with the second probe (36, 37). The diameter of the first probe (41, 42) is greater than that of the second probe (36, 37).