The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 1994

Filed:

Jul. 28, 1993
Applicant:
Inventors:

Seiji Itoyama, Chiba, JP;

Hidenari Kitaoka, Okayama, JP;

Toshikazu Sakuraya, Chiba, JP;

Kenichi Sorimachi, Chiba, JP;

Saburo Moriwaki, Chiba, JP;

Sumio Yamada, Chiba, JP;

Chikashi Tada, Chiba, JP;

Takahiro Mitumune, Hyogo, JP;

Shinichi Kaneko, Hyogo, JP;

Masafumi Maeda, Saitama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C21C / ; B22C / ;
U.S. Cl.
CPC ...
75305 ; 75309 ; 75327 ; 501125 ;
Abstract

A mold powder for use in continuous casting, containing specified amounts of CaO, Al.sub.2 O.sub.3, TiO.sub.2, Li.sub.2 O, BaO, MgO, F and Na.sub.2 O, and further containing at least one of BN and C as aggregate. The mold powder, when used in continuous casting of a steel rich in strong reducing metal elements such as Al, Ti, REM and so forth, remarkably suppresses generation of deterioration in the surface quality of the slab and break out of the slab which are attributable inferior lubrication.


Find Patent Forward Citations

Itoyama, Seiji. (1994). Mold powder for continuous casting (U.S. Patent No. 5356454). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5356454

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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