Wideband solderless right-angle rf interconnect

Abstract

A solderless right-angle interconnect is provided for achieving flexible, low-profile and enhanced performance high frequency signal interconnections. The interconnect includes a conductive pin which has a first end electrically coupled to a first transmission path and a second end electrically coupled to a stripline circuit trace which provides a second transmission path. A springy compressible conductive button is located in a recessed chamber at the second end of the conductive pin and partially extends from the end thereof. The second end of the conductive pin further includes at least one tapered edge. A conductive ground layer is further provided for substantially enclosing the interconnect and providing a ground reference thereabout. In a first embodiment, the conductor forming the first transmission path includes a coaxial cable coupled to the conductive pin. In a second embodiment, the first transmission path may include a second stripline circuit trace, in which the first end of said conductive pin likewise includes a recessed chamber for receiving a springy compressible conductive button and at least one tapered edge.