The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 1994
Filed:
Oct. 14, 1993
Applicant:
Inventors:
Makoto Hamada, Tokyo, JP;
Hiroshi Ise, Tokyo, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C / ; B29C / ; B29C / ; B29C / ;
U.S. Cl.
CPC ...
425544 ; 425556 ; 4254 / ; 425444 ; 425D / ; 425D / ; 26427217 ; 2643289 ;
Abstract
A metal mold for sealing a semiconductor device with a resin and including a shutter gate mechanism. The mold drives a shutter gate pin by using the ejection stroke of a conventional seal press, and therefore eliminates the need for an extra drive source. It follows that the mold can be implemented only if an existing facility is slightly modified, and it is lower in cost than conventional metal molds.