The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 11, 1994

Filed:

Mar. 04, 1992
Applicant:
Inventor:

Harold E Fuchs, Kansas City, MO (US);

Assignee:

AT&T Bell Laboratories, Murray Hill, NJ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
257698 ; 257786 ;
Abstract

Disclosed is a method for fabricating devices, and the resulting products, using Tape Automated Bonding (TAB) technology. Via holes are formed through a flexible insulating layer, such as polyimide, and are plated through when conductive fingers are formed on one surface of the layer. The resulting structure is then bonded to a semiconductor chip by means of the conductive pads formed on the surface of the insulating layer opposite to the conductive fingers.


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