The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 1994
Filed:
Nov. 20, 1992
Yasuyuki Nakamura, Suita, JP;
Shin Nemoto, Suita, JP;
Sumitomo Special Metal Co. Ltd., Osaka, JP;
Abstract
In a lead frame material made of a strip of copper or copper alloy sheet for use in resin packages in which semiconductor chips are mounted to and resin-sealed in island portions of a lead frame fabricated from a strip of substrate material, the lead frame material includes selective spot-clad material in which metal foils of low thermal expansion, each of a predetermined size, are roll-bonded and arranged at a predetermined interval to respective positions to be formed with island portions in the longitudinal direction of the substrate material, either on the surface where the semiconductor chips are not to be mounted or on both the surface where the semiconductor chips are to be mounted and on the opposite side. Damage to the chips such as warping or peeling can be prevented during heating upon mounting them.