The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 1994
Filed:
Aug. 16, 1991
Applicant:
Inventors:
Hiroshi Tsukahara, Kurashiki, JP;
Masahiko Niino, Kurashiki, JP;
Assignee:
Asahi Kasei Kogyo Kabushiki Kaisha, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L / ;
U.S. Cl.
CPC ...
524413 ; 524100 ; 524198 ; 524211 ; 524214 ; 524237 ; 524424 ; 524425 ; 524436 ; 524445 ; 524451 ; 524456 ; 524493 ; 524494 ; 524495 ; 524496 ; 524500 ; 524538 ; 525398 ; 525399 ; 525400 ; 525427 ; 525424 ; 525428 ;
Abstract
An engineering polyacetal resin composition comprising 0.05-20 parts by weight of a dispersant (B) and 5-40 parts by weight of a filler (C), and 100 parts by weight of a resin ingredient (A) which comprises 90-50% by weight of a polyacetal resin (a) and 10-50% by weight of a polyamide resin (b) having a melting point of up to 230.degree. C., a maximum particle diameter of 0.03-10 .mu.m and a maximum aspect ratio of up to 2, and is dispersed in a matrix of said polyacetal resin (a).
Tsukahara, Hiroshi. (1994). Polyacetal resin composition having high-temperature stiffness (U.S. Patent No. 5354798). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5354798
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