The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 1994
Filed:
Mar. 11, 1992
Applicant:
Inventors:
Kazunori Kato, Tokyo, JP;
Hideo Hotta, Tokyo, JP;
Assignee:
Dai Nippon Printing Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23F / ;
U.S. Cl.
CPC ...
156664 ; 437220 ; 156666 ;
Abstract
A process for producing a leadframe for a semiconductor including (i) providing nickel or nickel-base alloy plating layers on both sides of a base material including an iron-base material or a copper-base material by electroplating or chemical plating so as to have a single layer thickness in the range of from 3 to 20 microns, (ii) applying a photoresist on both sides of the leadframe material produced in step (i) and forming a leadframe pattern by a patterning process and (iii) subjecting the leadframe material patterned in step (ii) to etching.